YL

Yan-Fu Lin

TSMC: 1 patents #1,597 of 3,065Top 55%
📍 Zhubeikou, TW: #77 of 123 inventorsTop 65%
Overall (2019): #216,331 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10510674 Fan-out package having a main die and a dummy die, and method of forming Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen 2019-12-17