Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Shang-Yun Hou, Wan-Yu Lee | 2019-12-17 |
| 10510648 | Fan-out package structure and method | Tzu-Wei Chiu | 2019-12-17 |