Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515921 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Kuo-Chung Yee | 2019-12-24 |
| 10510695 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2019-12-17 |
| 10475747 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2019-11-12 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |
| 10340249 | Semiconductor device and method | Chen-Hua Yu, Kuo-Chung Yee | 2019-07-02 |
| 10283473 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2019-05-07 |
| 10269851 | Methods and apparatus for sensor module | Kuo-Chung Yee | 2019-04-23 |
| 10177078 | Method for forming chip package structure | Chen-Hua Yu, Kuo-Chung Yee | 2019-01-08 |