Issued Patents 2019
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2019-04-30 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2019-04-23 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2019-04-23 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Wei-Yu Chen | 2019-04-23 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2019-04-16 |
| 10192848 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Chung-Shi Liu | 2019-01-29 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang +1 more | 2019-01-29 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2019-01-08 |
| 10170434 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Chung-Shi Liu | 2019-01-01 |