Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chung-Shi Liu, Hsien-Wei Chen | 2019-10-22 |
| 10192848 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |