Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515788 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ching-Hua Hsieh, Syun-Ming Jang | 2019-12-24 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10497615 | Semiconductor device and method | Yu-Sheng Wang, Chi-Cheng Hung, Ching-Hwanq Su, Liang-Yueh Ou Yang, Yu-Ting Lin | 2019-12-03 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Wei-Jung Lin +3 more | 2019-11-12 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2019-07-23 |
| 10297453 | Pre-deposition treatment and atomic layer deposition (ALD) process and structures formed thereby | Cheng-Yen Tsai, Da-Yuan Lee, JoJo Lee, Hsueh Wen Tsau, Weng Chang +2 more | 2019-05-21 |
| 10262944 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2019-04-16 |
| 10170417 | Semiconductor structure | Chung-Chiang Wu, Chia-Ching Lee, Hsueh Wen Tsau, Chun-Yuan Chou, Cheng-Yen Tsai +1 more | 2019-01-01 |