Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522399 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2019-12-31 |
| 10508356 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2019-12-17 |
| 10504832 | Method for manufacturing copper layer | Ken-Yu Chang | 2019-12-10 |
| 10438846 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2019-10-08 |
| 10340223 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2019-07-02 |
| 10312098 | Method of forming an interconnect structure | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2019-06-04 |
| 10276431 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2019-04-30 |
| 10262944 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2019-04-16 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2019-02-05 |