Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354914 | Global dielectric and barrier layer | — | 2019-07-16 |
| 10312098 | Method of forming an interconnect structure | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2019-06-04 |
| 10276431 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2019-04-30 |