Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504832 | Method for manufacturing copper layer | Hung-Wen Su | 2019-12-10 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2019-07-23 |
| 10332789 | Semiconductor device with TiN adhesion layer for forming a contact plug | Tien-Pei Chou, Chun-Chieh Wang, Yueh-Ching Pai, Yu-Ting Lin, Yu-Wen Cheng | 2019-06-25 |