Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2019-07-23 |
| 10283359 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2019-05-07 |