Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2019-11-12 |
| 10431937 | Electric connector for electronic device | Pao-Min Huang, Yan-Fong Cheng, Yi-Ta Huang, Wu-Chen Lee, Cheng-Nan Ling +1 more | 2019-10-01 |
| 10361120 | Conductive feature formation and structure | Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2019-07-23 |