Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2019-11-12 |
| 10373907 | Conductive structure and method of forming the same | Chih-Wei Chang | 2019-08-06 |