Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510664 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chi-Hsuan Ni, Cheng-Tung Lin, Huang-Yi Huang +4 more | 2019-12-17 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2019-11-12 |