Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2019-11-12 |
| 10269713 | Contact structure and method of forming | Yu-Hung Lin, Sheng-Hsuan Lin | 2019-04-23 |