Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483165 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Chen-Yuan Kao, Yi-Wei Chiu, Liang-Yueh Ou Yang | 2019-11-19 |
| 10468530 | Semiconductor structure with source/drain multi-layer structure and method for forming the same | Chun-Chieh Wang, Yu-Ting Lin, Shih-Chieh Chang, Huai-Tei Yang | 2019-11-05 |
| 10332789 | Semiconductor device with TiN adhesion layer for forming a contact plug | Tien-Pei Chou, Ken-Yu Chang, Chun-Chieh Wang, Yu-Ting Lin, Yu-Wen Cheng | 2019-06-25 |
| 10186456 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Chen-Yuan Kao, Yi-Wei Chiu, Liang-Yueh Ou Yang | 2019-01-22 |