Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522360 | Method for forming semiconductor device structure with etch stop layer | Ya-Ling Lee, Keng-Chu Lin, Wen-Cheng Yang, Chih-Tsung Lee, Victor Lu | 2019-12-31 |
| 10515788 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Ching-Hua Hsieh, Ming-Hsing Tsai, Syun-Ming Jang | 2019-12-24 |
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee +1 more | 2019-12-17 |
| 10468297 | Metal-based etch-stop layer | Szu-Ping Tung, Yu-Kai Lin, Jen Hung Wang | 2019-11-05 |
| 10361112 | High aspect ratio gap fill | Wan-Lin Tsai, Sung-En Lin, Tze-Liang Lee, Jung-Hau Shiu, Jen Hung Wang | 2019-07-23 |
| 10312107 | Forming interconnect structure using plasma treated metal hard mask | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Shwang-Ming Jeng | 2019-06-04 |