Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522360 | Method for forming semiconductor device structure with etch stop layer | Ya-Ling Lee, Shing-Chyang Pan, Wen-Cheng Yang, Chih-Tsung Lee, Victor Lu | 2019-12-31 |
| 10510580 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Shwang-Ming Jeng, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2019-12-17 |
| 10510874 | Semiconductor device | Kuo-Cheng Ching, Kuan-Lun Cheng, Chih-Hao Wang, Shi Ning Ju | 2019-12-17 |
| 10510895 | Device and method of dielectric layer | Yu-Yun Peng | 2019-12-17 |
| 10312107 | Forming interconnect structure using plasma treated metal hard mask | Chung-Chi Ko, Chia-Cheng Chou, Shing-Chyang Pan, Shwang-Ming Jeng | 2019-06-04 |
| 10290739 | Device and method of dielectric layer | Yu-Yun Peng | 2019-05-14 |
| 10181443 | Support structure for barrier layer of semiconductor device | Joung-Wei Liou | 2019-01-15 |