CL

Chin-Hsiang Lin

TSMC: 19 patents #40 of 3,065Top 2%
Overall (2019): #2,303 of 560,194Top 1%
19
Patents 2019

Issued Patents 2019

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
10520813 Extreme ultraviolet photoresist with high-efficiency electron transfer Wei-Han Lai, Chien-Wei Wang 2019-12-31
10520833 Extreme ultraviolet lithography system Ming-Hui Weng, Cheng-Han Wu, Ching-Yu Chang 2019-12-31
10520822 Lithography techniques for reducing resist swelling Ming-Hui Weng, Cheng-Han Wu, Ching-Yu Chang 2019-12-31
10520821 Lithography process with enhanced etch selectivity Chen-Yu Liu, Ching-Yu Chang 2019-12-31
10520820 Negative tone developer for extreme ultraviolet lithography Chen-Yu Liu, Wei-Han Lai, Tzu-Yang Lin, Ming-Hui Weng, Ching-Yu Chang 2019-12-31
10514247 Wafer alignment mark scheme Wei-Hsiang Tseng, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen 2019-12-24
10514597 Lithography mask with both transmission-type and reflective-type overlay marks and method of fabricating the same Yun-Yue Lin, Hsin-Chang Lee, Chia-Jen Chen, Chih-Cheng Lin, Anthony Yen 2019-12-24
10515812 Methods of reducing pattern roughness in semiconductor fabrication Chien-Wei Wang, Joy Cheng, Ching-Yu Chang 2019-12-24
10515847 Method for forming vias and method for forming contacts in vias Tzu-Yang Lin, Cheng-Han Wu, Ching-Yu Chang 2019-12-24
10517179 Material composition and methods thereof Siao-Shan Wang, Cheng-Han Wu, Ching-Yu Chang 2019-12-24
10510580 Dummy fin structures and methods of forming same Keng-Chu Lin, Shwang-Ming Jeng, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen 2019-12-17
10401728 Extreme ultraviolet photoresist and method Yen-Hao Chen, Wei-Han Lai, Chien-Wei Wang 2019-09-03
10394123 Blocking layer material composition and methods thereof in semiconductor manufacturing Siao-Shan Wang, Chen-Yu Liu, Ching-Yu Chang 2019-08-27
10381481 Multi-layer photoresist An-Ren Zi, Ching-Yu Chang 2019-08-13
10366973 Layout modification method for exposure manufacturing process Hung-Wen Cho, Fu-Jye Liang, Chun-Kuang Chen, Chih-Tsung Shih, Li-Jui Chen +1 more 2019-07-30
10354874 Directional processing to remove a layer or a material formed over a substrate Shih-Chun Huang, Chien-Wen Lai, Ru-Gun Liu, Wei-Liang Lin, Ya Hui Chang +3 more 2019-07-16
10312108 Method for forming semiconductor structure using modified resist layer Li-Po YANG, Chien-Wei Wang, Wei-Han Lai 2019-06-04
10274847 Humidity control in EUV lithography An-Ren Zi, Ching-Yu Chang, Joy Cheng 2019-04-30
10269628 FinFET low resistivity contact formation method Sung-Li Wang, Ding-Kang Shih, Sey-Ping Sun, Clement Hsingjen Wann 2019-04-23