Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2019-12-17 |
| 10312107 | Forming interconnect structure using plasma treated metal hard mask | Chung-Chi Ko, Shing-Chyang Pan, Keng-Chu Lin, Shwang-Ming Jeng | 2019-06-04 |
| 10269627 | Interconnect structure and method | Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2019-04-23 |