Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515822 | Method for preventing bottom layer wrinkling in a semiconductor device | Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2019-12-24 |
| 10510584 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-12-17 |
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2019-12-17 |
| 10361112 | High aspect ratio gap fill | Wan-Lin Tsai, Shing-Chyang Pan, Sung-En Lin, Tze-Liang Lee, Jen Hung Wang | 2019-07-23 |
| 10340178 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-07-02 |