Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510686 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Lin Wang | 2019-12-17 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2019-10-29 |