Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510704 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2019-12-17 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2019-12-17 |
| 10446521 | Integrated fan-out package and method of fabricating an integrated fan-out package | Hung-Jui Kuo, Yu-Hsiang Hu | 2019-10-15 |
| 10332856 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2019-06-25 |
| 10276421 | Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages | Hung-Jui Kuo, Yu-Hsiang Hu | 2019-04-30 |
| 10276543 | Semicondcutor device package and method of forming semicondcutor device package | Hung-Jui Kuo, Yu-Hsiang Hu | 2019-04-30 |