Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522440 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2019-12-31 |
| 10510645 | Planarizing RDLs in RDL-first processes through CMP process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2019-12-17 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2019-12-17 |
| 10332856 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2019-06-25 |
| 10283461 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2019-05-07 |