Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522501 | Semiconductor structure and method of forming the same | Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2019-12-31 |
| 10515848 | Semiconductor package and method | Hung-Jui Kuo, Yun Chen Hsieh | 2019-12-24 |
| 10361122 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2019-07-23 |
| 10340206 | Dense redistribution layers in semiconductor packages and methods of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2019-07-02 |
| 10297551 | Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package | Hung-Jui Kuo, Yun Chen Hsieh | 2019-05-21 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2019-04-30 |
| 10186462 | Semiconductor device and method | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kou | 2019-01-22 |