Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515874 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2019-12-24 |
| 10510701 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2019-12-17 |
| 10504776 | Methods for forming through-substrate vias penetrating inter-layer dielectric | Ming-Fa Chen, Yu-Young Wang | 2019-12-10 |
| 10312201 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2019-06-04 |