Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504776 | Methods for forming through-substrate vias penetrating inter-layer dielectric | Ming-Fa Chen, Sen-Bor Jan | 2019-12-10 |
| 10307798 | Cleaning device for cleaning electroplating substrate holder | Chung-En Kao, Victor Lu | 2019-06-04 |