Issued Patents 2019
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290571 | Packages with si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2019-05-14 |
| 10283479 | Package structures and methods of forming the same | Li-Hsien Huang, An-Jhih Su | 2019-05-07 |
| 10283375 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10276549 | Package structure with dummy die | Li-Hsien Huang | 2019-04-30 |
| 10276496 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2019-04-30 |
| 10269767 | Multi-chip packages with multi-fan-out scheme and methods of manufacturing the same | Jie Chen | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu | 2019-04-23 |
| 10269749 | Method of forming a semiconductor device with bump stop structure | Jie Chen | 2019-04-23 |
| 10269745 | Pad design for reliability enhancement in packages | — | 2019-04-23 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |
| 10269738 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10269693 | Packaged semiconductor devices and methods of packaging thereof | — | 2019-04-23 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269764 | Discrete polymer in fan-out packages | Jie Chen | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |
| 10262952 | Ring structures in device die | Ying-Ju Chen, Jie Chen | 2019-04-16 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2019-04-16 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, An-Jhih Su, Li-Hsien Huang | 2019-02-26 |
| 10204863 | Semiconductor package structure | Jie Chen | 2019-02-12 |
| 10204883 | Semiconductor device and manufacturing method thereof | Jie Chen | 2019-02-12 |
| 10181449 | Semiconductor structure | Jie Chen, Ying-Ju Chen | 2019-01-15 |
| 10177032 | Devices, packaging devices, and methods of packaging semiconductor devices | An-Jhih Su, Jo-Mei Wang | 2019-01-08 |