Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510561 | Semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Wen-Chih Chiou, Shin-Puu Jeng | 2019-12-17 |