Issued Patents 2019
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283375 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10276484 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2019-04-30 |
| 10269619 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2019-04-23 |
| 10177115 | Package structures and methods of forming | Chen-Hua Yu, Hsien-Wei Chen | 2019-01-08 |