Issued Patents 2019
Showing 151–154 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177104 | Package on package structure and method for forming the same | Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2019-01-08 |
| 10175294 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2019-01-08 |
| 10170396 | Through via structure extending to metallization layer | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou, Shin-Puu Jeng | 2019-01-01 |
| 10170451 | Semiconductor device method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2019-01-01 |