Issued Patents All Time
Showing 25 most recent of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more | 2025-09-23 |
| 12412842 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia | 2025-09-09 |
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12406893 | Edge-aligned template structure for integrated circuit packages | Omkar G. Karhade, Nitin A. Deshpande | 2025-09-02 |
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2025-08-26 |
| 12347783 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2025-07-01 |
| 12347807 | Inorganic fill material for stacked die assembly | Mohammad Enamul Kabir | 2025-07-01 |
| 12341281 | Micro socket electrical couplings for dies | Srikant Nekkanty, Joe Walczyk, Saikumar Jayaraman, Feroz Mohammad | 2025-06-24 |
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Biancun Xie, Jianyong Xie, Sujit Sharan, Robert L. Sankman | 2025-06-24 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman | 2025-05-13 |
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2025-04-22 |
| 12272650 | Microelectronic package with substrate cavity for bridge-attach | Omkar G. Karhade, Nitin A. Deshpande, Amruthavalli Pallavi Alur | 2025-04-08 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-04-08 |
| 12243806 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane | 2025-03-04 |
| 12218040 | Nested interposer with through-silicon via bridge die | Srinivas V. Pietambaram, Kristof Darmawikarta, Ravindranath V. Mahajan, Rahul N. Manepalli | 2025-02-04 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Sergio Antonio Chan Arguedas, Jimin Yao, Chandra Mohan Jha | 2025-01-21 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-01-14 |
| 12183649 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2024-12-31 |
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2024-12-31 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |
| 12142567 | Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density | Xiao Di SUN ZHOU, Xiaoying Guo | 2024-11-12 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane | 2024-11-12 |
| 12107042 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 |
| 11984396 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |