Issued Patents All Time
Showing 26–50 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Sameer Paital, Gang Duan, Srinivas V. Pietambaram | 2024-03-12 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11908821 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Sri Ranga Sai Boyapati, Hiroki Tanaka, Robert Alan May | 2024-02-20 |
| 11901296 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-13 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Robert L. Sankman +1 more | 2024-02-06 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Hiroki Tanaka, Rahul N. Manepalli, Sri Ranga Sai Boyapati | 2024-01-02 |
| 11854834 | Integrated circuit package supports | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati, Bai Nie | 2023-12-05 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown | 2023-10-31 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Roy Dittler, Jeremy Ecton, Darko Grujicic | 2023-10-17 |
| 11784128 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2023-10-10 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Veronica Strong, Arnab Sarkar | 2023-08-15 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2023-07-11 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Andrew J. Brown, Sri Ranga Sai Boyapati | 2023-01-10 |
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2022-12-20 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie +2 more | 2022-12-06 |