Issued Patents All Time
Showing 76–98 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Sri Ranga Sai Boyapati, Sandeep Gaan, Srinivas V. Pietambaram | 2021-06-15 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen, Javier Soto Gonzalez | 2021-04-13 |
| 10937594 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Thomas L. Sounart, Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2021-03-02 |
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad | 2020-12-01 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2020-12-01 |
| 10790233 | Package substrates with integral devices | Robert Alan May, Sri Ranga Sai Boyapati | 2020-09-29 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Robert Alan May, Sri Ranga Sai Boyapati | 2020-07-28 |
| 10714434 | Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates | Srinivas V. Pietambaram, Aleksandar Aleksov | 2020-07-14 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama +1 more | 2020-02-04 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Henning Braunisch, Prashant Parmar +3 more | 2019-11-12 |
| 10453812 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Aleksandar Aleksov, Sri Ranga Sai Boyapati, Robert Alan May | 2019-10-22 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2019-10-01 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2019-09-03 |
| 10361121 | Aluminum oxide for thermal management or adhesion | Sri Ranga Sai Boyapati | 2019-07-23 |
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Arnab Sarkar, Hiroki Tanaka, Robert Alan May, Sri Ranga Sai Boyapati | 2018-11-06 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Robert Alan May +1 more | 2018-08-07 |
| 10026691 | Package substrate having noncircular interconnects | Kyu Oh Lee, Daniel N. Sobieski | 2018-07-17 |
| 9953959 | Metal protected fan-out cavity | Robert Alan May, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 |
| 9820386 | Plasma etching of solder resist openings | Rahul Jain, Robert Alan May, Sheng Li, Sri Ranga Sai Boyapati | 2017-11-14 |