Issued Patents All Time
Showing 101–125 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7319068 | Method of depositing low k barrier layers | Ping Xu, Louis Yang | 2008-01-15 |
| 7253123 | Method for producing gate stack sidewall spacers | Reza Arghavani, Michael Kwan, Kang Sub Yim | 2007-08-07 |
| 7244672 | Selective etching of organosilicate films over silicon oxide stop etch layers | Huong Nguyen, Michael Barnes, Mehul Naik | 2007-07-17 |
| 7229911 | Adhesion improvement for low k dielectrics to conductive materials | Nagarajan Rajagopalan, Meiyee Shek, Albert Lee, Annamalai Lakshmanan, Zhenjiang Cui | 2007-06-12 |
| 7226876 | Method of modifying interlayer adhesion | Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman | 2007-06-05 |
| 7183201 | Selective etching of organosilicate films over silicon oxide stop etch layers | Huong Nguyen, Michael Barnes, Mehul Naik | 2007-02-27 |
| 7166544 | Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors | Deenesh Padhi, Sohyun Park, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Derek R. Witty +1 more | 2007-01-23 |
| 7160821 | Method of depositing low k films | Tzu-Fang Huang, Yung-Cheng Lu, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2007-01-09 |
| 7157384 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee | 2007-01-02 |
| 7153787 | CVD plasma assisted lower dielectric constant SICOH film | Seon-Mee Cho, Peter Wai-Man Lee, Chi-I Lang, Dian Sugiarto, Chen-An Chen +2 more | 2006-12-26 |
| 7151053 | Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Fei Han, Ellie Yieh +5 more | 2006-12-19 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Tzu-Fang Huang +6 more | 2006-11-07 |
| 7132353 | Boron diffusion barrier by nitrogen incorporation in spacer dielectrics | Mei-Yee Shek, Troy Kim, Vladamir Zubkov, Ritwik Bhatia | 2006-11-07 |
| 7125813 | Method of depositing low K barrier layers | Ping Xu, Louis Yang | 2006-10-24 |
| 7117064 | Method of depositing dielectric films | Srinivas D. Nemani, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-10-03 |
| 7115508 | Oxide-like seasoning for dielectric low k films | Sohyun Park, Wen Zhu, Tzu-Fang Huang, Hichem M'Saad | 2006-10-03 |
| 7112541 | In-situ oxide capping after CVD low k deposition | Huiwen Xu, Derek R. Witty, Hichem M'Saad | 2006-09-26 |
| 7091137 | Bi-layer approach for a hermetic low dielectric constant layer for barrier applications | Albert Lee, Annamalai Lakshmanan, Bok Hoen Kim, Mei-Yee Shek Le | 2006-08-15 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition | Frederic Gaillard, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau, Shin-Puu Jeng +2 more | 2006-07-11 |
| 7060330 | Method for forming ultra low k films using electron beam | Yi Zheng, Srinivas D. Nemani, Eric Hollar, Kang Sub Yim | 2006-06-13 |
| 7056560 | Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Yi Zheng, Srinivas D. Nemani, Eric Hollar | 2006-06-06 |
| 7049249 | Method of improving stability in low k barrier layers | Lihua Li, Tzu-Fang Huang | 2006-05-23 |
| 7034409 | Method of eliminating photoresist poisoning in damascene applications | Ping Xu, Larry Dworkin, Mehul Naik | 2006-04-25 |
| 7030041 | Adhesion improvement for low k dielectrics | Lihua Li, Tzu-Fang Huang, Peter Wai-Man Lee, Hichem M'Saad, Zhenjiang Cui +2 more | 2006-04-18 |
| 7001850 | Method of depositing dielectric films | Srinivas D. Nemani, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-02-21 |