Issued Patents All Time
Showing 76–100 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851384 | Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film | Yijun Liu, Huiwen Xu, Chad Peterson, Hichem M'Saad | 2010-12-14 |
| 7851385 | Low temperature conformal oxide formation and applications | Matthew Spuller, Melody Agustin, Meiyee Shek, Reza Arghavani | 2010-12-14 |
| 7816205 | Method of forming non-volatile memory having charge trap layer with compositional gradient | Mihaela Balseanu, Vladimir Zubkov, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2010-10-19 |
| 7802538 | Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors | Deenesh Padhi, Sohyun Park, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Derek R. Witty +1 more | 2010-09-28 |
| 7790635 | Method to increase the compressive stress of PECVD dielectric films | Mihaela Balseanu, Victor Nguyen, Vladimir Zubkov, Derek R. Witty, Hichem M'Saad | 2010-09-07 |
| 7780865 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Mei-Yee Shek, Hichem M'Saad | 2010-08-24 |
| 7749563 | Two-layer film for next generation damascene barrier application with good oxidation resistance | Yi Zheng, Srinivas D. Nemani | 2010-07-06 |
| 7745328 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee | 2010-06-29 |
| 7732342 | Method to increase the compressive stress of PECVD silicon nitride films | Mihaela Balseanu, Vladimir Zubkov, Mei-Yee Shek, Isabelita Rolfox, Hichem M'Saad | 2010-06-08 |
| 7718548 | Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface | Sang-Mok Lee, Vladimir Zubkov, Zhenijiang Cui, Meiyee Shek, Hichem M'Saad | 2010-05-18 |
| 7704816 | Boron derived materials deposition method | Jeong-Uk Huh, Mihaela Balseanu, Derek R. Witty, Hichem M'Saad | 2010-04-27 |
| 7700486 | Oxide-like seasoning for dielectric low k films | Sohyun Park, Wen Zhu, Tzu-Fang Huang, Hichem M'Saad | 2010-04-20 |
| 7670924 | Air gap integration scheme | Alexandros T. Demos, Bok Hoen Kim, Derek R. Witty, Hichem M'Saad | 2010-03-02 |
| 7611996 | Multi-stage curing of low K nano-porous films | Francimar Schmitt, Yi Zheng, Kang Sub Yim, Sang-Hoon Ahn, Lester D'Cruz +4 more | 2009-11-03 |
| 7601651 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Meiyee Shek, Hichem M'Saad | 2009-10-13 |
| 7588803 | Multi step ebeam process for modifying dielectric materials | Alexandros T. Demos, Tzu-Fang Huang, Wen Zhu | 2009-09-15 |
| 7566655 | Integration process for fabricating stressed transistor structure | Mihaela Balseanu, Jia-Sheng Lee, Mei-Yee Shek, Amir Al-Bayati, Hichem M'Saad | 2009-07-28 |
| 7563728 | Methods of modifying interlayer adhesion | Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman | 2009-07-21 |
| 7501355 | Decreasing the etch rate of silicon nitride by carbon addition | Ritwik Bhatia, Chad Peterson, Hichem M'Saad | 2009-03-10 |
| 7465659 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee | 2008-12-16 |
| 7459404 | Adhesion improvement for low k dielectrics | Lihua Li, Tzu-Fang Huang, Peter Wai-Man Lee, Hichem M'Saad, Zhenjiang Cui +2 more | 2008-12-02 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Tzu-Fang Huang +6 more | 2008-10-14 |
| 7422776 | Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Lihua Huang, Francimar Schmitt | 2008-09-09 |
| 7422774 | Method for forming ultra low k films using electron beam | Yi Zheng, Srinivas D. Nemani, Eric Hollar, Kang Sub Yim | 2008-09-09 |
| 7326657 | Post-deposition treatment to enhance properties of Si-O-C low k films | Frederic Gaillard, Ellie Yieh, Tian-Hoe Lim | 2008-02-05 |