LX

Li-Qun Xia

Applied Materials: 195 patents #8 of 7,310Top 1%
IBM: 2 patents #32,839 of 70,183Top 50%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
📍 Cupertino, CA: #24 of 6,989 inventorsTop 1%
🗺 California: #578 of 386,348 inventorsTop 1%
Overall (All Time): #3,524 of 4,157,543Top 1%
196
Patents All Time

Issued Patents All Time

Showing 126–150 of 196 patents

Patent #TitleCo-InventorsDate
6943127 CVD plasma assisted lower dielectric constant SICOH film Seon-Mee Cho, Peter Wai-Man Lee, Chi-I Lang, Dian Sugiarto, Chen-An Chen +2 more 2005-09-13
6936551 Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices Farhad Moghadam, Jun Zhao, Timothy Weidman, Rick J. Roberts, Alexandros T. Demos 2005-08-30
6936309 Hardness improvement of silicon carboxy films Lihua Li, Tzu-Fang Huang, Ellie Yieh 2005-08-30
6921727 Method for modifying dielectric characteristics of dielectric layers Kang-Lie Chiang, Mahmoud Dahimene, Xiaoye Zhao, Yan Ye, Gerardo Delgadino +2 more 2005-07-26
6913992 Method of modifying interlayer adhesion Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman 2005-07-05
6914014 Method for curing low dielectric constant film using direct current bias Lihua Li, Tzu-Fang Huang, Juan Carlos Rocha-Alvarez, Maosheng Zhao 2005-07-05
6911403 Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics Lihua Li, Tsutomu Tanaka, Tzu-Fang Huang, Dian Sugiarto, Visweswaren Sivaramakrishnan +2 more 2005-06-28
6899763 Lid cooling mechanism and method for optimized deposition of low-K dielectric using TR methylsilane-ozone based processes Himansu Pokharna, Tian-Hoe Lim 2005-05-31
6890850 Method of depositing dielectric materials in damascene applications Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Fei Han, Ellie Yieh +5 more 2005-05-10
6878620 Side wall passivation films for damascene cu/low k electronic devices Son V. Nguyen, Srinivas D. Nemani 2005-04-12
6858923 Post-deposition treatment to enhance properties of Si-O-C low films Frederic Gaillard, Ellie Yieh, Tian-Hoe Lim 2005-02-22
6849562 Method of depositing a low k dielectric barrier film for copper damascene application Chi-I Lang, Ping Xu, Louis Yang 2005-02-01
6838393 Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee 2005-01-04
6815373 Use of cyclic siloxanes for hardness improvement of low k dielectric films Vinita Singh, Srinivas D. Nemani, Yi Zheng, Lihua Li, Tzu-Fang Huang +1 more 2004-11-09
6806207 Method of depositing low K films Tzu-Fang Huang, Yung-Cheng Lu, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more 2004-10-19
6797643 Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power Juan Carlos Rocha-Alvarez, Maosheng Zhao, Ying Yu, Shankar Venkataraman, Srinivas D. Nemani 2004-09-28
6790788 Method of improving stability in low k barrier layers Lihua Li, Tzu-Fang Huang 2004-09-14
6784119 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition Frederic Gaillard, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau, Shin-Puu Jeng +2 more 2004-08-31
6777171 Fluorine-containing layers for damascene structures Ping Xu, Jia-Sheng Lee, Ishing Lou 2004-08-17
6764958 Method of depositing dielectric films Srinivas D. Nemani, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more 2004-07-20
6759327 Method of depositing low k barrier layers Ping Xu, Louis Yang 2004-07-06
6753258 Integration scheme for dual damascene structure Frederic Gaillard, Ellie Yieh, Paul Fisher, Margaret Gotuaco 2004-06-22
6750141 Silicon carbide cap layers for low dielectric constant silicon oxide layers Paul Fisher, Margaret Gotuaco, Frederic Gaillard, Ellie Yieh 2004-06-15
6699784 Method for depositing a low k dielectric film (K>3.5) for hard mask application Ping Xu, Louis Yang, Tzu-Fang Huang, Wen Zhu 2004-03-02
6680164 Solvent free photoresist strip and residue removal processing for post etching of low-k films Huong Nguyen, Mark Kawaguchi, Mehul Naik, Ellie Yieh 2004-01-20