Issued Patents All Time
Showing 51–75 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8563090 | Boron film interface engineering | Mihaela Balseanu, Derek R. Witty, Yi-Hsing Chen | 2013-10-22 |
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen | 2013-09-17 |
| 8501568 | Method of forming flash memory with ultraviolet treatment | Mihaela Balseanu, Vladimir Zubkov, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2013-08-06 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen | 2013-07-23 |
| 8481422 | Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer | Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Mei-Yee Shek, Lipan Li +1 more | 2013-07-09 |
| 8445075 | Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics | Huiwen Xu, Mei-Yee Shek, Amir Al-Bayati, Derek R. Witty, Hichem M'Saad | 2013-05-21 |
| 8389376 | Air gap integration scheme | Alexandros T. Demos, Bok Hoen Kim, Derek R. Witty, Hichem M'Saad | 2013-03-05 |
| 8343881 | Silicon dioxide layer deposited with BDEAS | Yong Won Lee, Vladimir Zubkov, Mei-Yee Shek, Prahallad Iyengar, Sanjeev Baluja +4 more | 2013-01-01 |
| 8337950 | Method for depositing boron-rich films for lithographic mask applications | Victor Nguyen, Yi-Hsing Chen, Mihaela Balseanu, Isabelita Roflox, Derek R. Witty | 2012-12-25 |
| 8329575 | Fabrication of through-silicon vias on silicon wafers | Nagarajan Rajagopalan, Ji Ae Park, Ryan Yamase, Shamik Patel, Thomas Nowak +5 more | 2012-12-11 |
| 8283237 | Fabrication of through-silicon vias on silicon wafers | Nagarajan Rajagopalan, Ji Ae Park, Ryan Yamase, Shamik Patel, Thomas Nowak +5 more | 2012-10-09 |
| 8252653 | Method of forming a non-volatile memory having a silicon nitride charge trap layer | Mihaela Balseanu, Vladimir Zubkov, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2012-08-28 |
| 8236684 | Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer | Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Meiyee Shek, Lipan Li +1 more | 2012-08-07 |
| 8148269 | Boron nitride and boron-nitride derived materials deposition method | Mihaela Balseanu, Christopher Dennis Bencher, Yongmei Chen, Li Yan Miao, Victor Nguyen +2 more | 2012-04-03 |
| 8143174 | Post-deposition treatment to enhance properties of Si-O-C low K films | Frederic Gaillard, Ellie Yieh, Tian-Hoe Lim | 2012-03-27 |
| 8138104 | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure | Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Hichem M'Saad, Mei-Yee Shek +1 more | 2012-03-20 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2012-03-06 |
| 8084105 | Method of depositing boron nitride and boron nitride-derived materials | Jeong-Uk Huh, Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Hichem M'Saad | 2011-12-27 |
| 7964442 | Methods to obtain low k dielectric barrier with superior etch resistivity | Huiwen Xu, Yijun Liu, Derek R. Witty, Hichem M'Saad | 2011-06-21 |
| 7960294 | Method of modifying interlayer adhesion | Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman | 2011-06-14 |
| 7951730 | Decreasing the etch rate of silicon nitride by carbon addition | Ritwik Bhatia, Chad Peterson, Hichem M'Saad | 2011-05-31 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Mei-Yee Shek, Hichem M'Saad | 2011-04-12 |
| 7910491 | Gapfill improvement with low etch rate dielectric liners | Young Soo Kwon, Bi Jang, Anchuan Wang, Young S. Lee, Mihaela Balseanu +1 more | 2011-03-22 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Kang Sub Yim, Mehul Naik, Zhenjiang Cui +2 more | 2011-02-01 |
| 7871926 | Methods and systems for forming at least one dielectric layer | Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Hichem M'Saad, Haichun Yang +3 more | 2011-01-18 |