Issued Patents All Time
Showing 26–50 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319583 | Selective deposition of silicon nitride films for spacer applications | Ning Li, Mihaela Balseanu | 2019-06-11 |
| 10273578 | Top lamp module for carousel deposition chamber | Joseph Yudovsky, Robert T. Trujillo, Kevin Griffin, Garry K. Kwong, Kallol Bera +1 more | 2019-04-30 |
| 10236198 | Methods for the continuous processing of substrates | Banqiu Wu, Nag B. Patibandla, Toshiaki Fujita, Ralf Hofmann, Pravin K. Narwankar +2 more | 2019-03-19 |
| 10170298 | High temperature silicon oxide atomic layer deposition technology | Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Mihaela Balseanu +1 more | 2019-01-01 |
| 10147599 | Methods for depositing low K and low wet etch rate dielectric thin films | Ning Li, Mark Saly, David Thompson, Mihaela Balseanu | 2018-12-04 |
| 10134581 | Methods and apparatus for selective dry etch | Ning Li, Mihaela Balseanu, Dongqing Yang, Anchuan Wang | 2018-11-20 |
| 10023958 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Mihaela Balseanu, Mark Saly, David Thompson | 2018-07-17 |
| 9984868 | PEALD of films comprising silicon nitride | Victor Nguyen, Woong Jae Lee, Mihaela Balseanu, Derek R. Witty | 2018-05-29 |
| 9875888 | High temperature silicon oxide atomic layer deposition technology | Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Mihaela Balseanu +1 more | 2018-01-23 |
| 9799511 | Methods for depositing low k and low wet etch rate dielectric thin films | Ning Li, Mark Saly, David Thompson, Mihaela Balseanu | 2017-10-24 |
| 9748125 | Continuous substrate processing system | Banqiu Wu, Nag B. Patibandla, Toshiaki Fujita, Ralf Hofmann, Pravin K. Narwankar +2 more | 2017-08-29 |
| 9646642 | Resist fortification for magnetic media patterning | Christopher Dennis Bencher, Roman Gouk, Steven Verhaverbeke, Yong Won Lee, Matthew D. Scotney-Castle +2 more | 2017-05-09 |
| 9633861 | Cu/barrier interface enhancement | Weifeng YE, Mei-Yee Shek, Mihaela Balseanu, Xiaojun Zhang, Xiaolan Ba +1 more | 2017-04-25 |
| 9580801 | Enhancing electrical property and UV compatibility of ultrathin blok barrier film | Xiaolan Ba, Weifeng YE, Mei-Yee Shek, Yu Jin, Deenesh Padhi +1 more | 2017-02-28 |
| 9478460 | Cobalt selectivity improvement in selective cobalt process sequence | Mei-Yee Shek, Weifeng YE, Kang Sub Yim, Kelvin Chan | 2016-10-25 |
| 9443716 | Precise critical dimension control using bilayer ALD | Kenji Takeshita, Nobuhiro Sakamoto, Yoshihiro Takenaga, Mandyam Sriram | 2016-09-13 |
| 9297073 | Accurate film thickness control in gap-fill technology | Ning Li, Wenbo Yan, Victor Nguyen, Cong Trinh, Mihaela Balseanu | 2016-03-29 |
| 9105695 | Cobalt selectivity improvement in selective cobalt process sequence | Mei-Yee Shek, Weifeng YE, Kang Sub Yim, Kelvin Chan | 2015-08-11 |
| 8852962 | Apparatus and methods for silicon oxide CVD resist planarization | Steven Verhaverbeke, Roman Gouk, Mei-Yee Shek, Yu Jin | 2014-10-07 |
| 8758638 | Copper oxide removal techniques | Weifeng YE, Victor Nguyen, Mei-Yee Shek, Mihaela Balseanu, Derek R. Witty | 2014-06-24 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2014-06-17 |
| 8658242 | Resist fortification for magnetic media patterning | Christopher Dennis Bencher, Roman Gouk, Steven Verhaverbeke, Yong Won Lee, Matthew D. Scotney-Castle +2 more | 2014-02-25 |
| 8598020 | Plasma-enhanced chemical vapor deposition of crystalline germanium | Victor Nguyen, Mihaela Balseanu, Derek R. Witty | 2013-12-03 |
| 8586487 | Low temperature plasma enhanced chemical vapor deposition of conformal silicon carbon nitride and silicon nitride films | Victor Nguyen, Mihaela Balseanu, Derek R. Witty | 2013-11-19 |
| 8569166 | Methods of modifying interlayer adhesion | Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman | 2013-10-29 |