Issued Patents 2021
Showing 51–75 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2021-08-31 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11101195 | Package structure and method for forming the same | Tung-Liang Shao, Wen-Lin Shih, Su-Chun Yang, Chih-Hang Tung | 2021-08-24 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11094671 | Package with thinned substrate | Chung-Hao Tsai, Chuei-Tang Wang | 2021-08-17 |
| 11094680 | Packages and methods of forming packages | Der-Chyang Yeh, An-Jhih Su | 2021-08-17 |
| 11094641 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2021-08-17 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2021-08-10 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11088131 | Semiconductor device that uses bonding layer to join semiconductor substrates together | Ming-Fa Chen | 2021-08-10 |
| 11081372 | Package system for integrated circuits | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2021-08-03 |
| 11075184 | Semiconductor package and method of fabricating semiconductor package | Kuo-Chung Yee, Chun-Hui Yu | 2021-07-27 |
| 11075145 | Semiconductor device including through die via and manufacturing method thereof | Kuo-Chung Yee | 2021-07-27 |
| 11075168 | InFO-POP structures with TIVs having cavities | Jing-Cheng Lin, Po-Hao Tsai | 2021-07-27 |
| 11075176 | Semiconductor device and method | Tzu-Sung Huang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2021-07-27 |
| 11066297 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2021-07-20 |
| 11069573 | Wafer level package structure and method of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11069965 | Low-profile broadband circularly-polarized array antenna using stacked traveling wave antenna elements | Haiming Wang, Qi Wu, Jiexi Yin, Wei Hong | 2021-07-20 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 11069636 | Package structure and method of forming the same | Chun-Hui Yu, Kuo-Chung Yee | 2021-07-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11069658 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2021-07-20 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chih-Yuan Chang, Chuei-Tang Wang, Jeng-Shien Hsieh | 2021-07-13 |