Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211336 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-12-28 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2021-10-05 |
| 11075184 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Kuo-Chung Yee | 2021-07-27 |
| 11069636 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-07-20 |
| 11031344 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-06-08 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |
| 10950554 | Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-03-16 |