Issued Patents 2021
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177137 | Wafer etching process and methods thereof | Wen-Hsiung Lu, Hui-Min Huang, Wei-Hung Lin, Chen-En Yen, Hsu-Lun Liu | 2021-11-16 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Wen-Hsiung Lu, Chang-Jung Hsueh, Kuan-Liang Lai | 2021-11-09 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin | 2021-10-26 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yung Ching Chen | 2021-10-05 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2021-08-24 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin +2 more | 2021-08-17 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Kuo-Ching Hsu +4 more | 2021-07-27 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin | 2021-07-06 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2021-06-29 |
| 11043463 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2021-06-22 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 11024593 | Metal bumps and method forming same | Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang, Yu-Feng Chen +1 more | 2021-06-01 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2021-05-11 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2021-04-06 |
| 10964663 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu | 2021-03-30 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2021-03-30 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2021-03-16 |
| 10950572 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu | 2021-03-16 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Mirng-Ji Lii | 2021-02-02 |