Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 11101261 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |