Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211341 | Package structure and method of fabrcating the same | Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2021-09-14 |
| 11069671 | Semiconductor package and method | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2021-06-29 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |