Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Ching-Hua Hsieh | 2021-09-14 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2021-06-29 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 11002927 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |