Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2021-12-28 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Jung Wei Cheng, Chien-Hsun Lee | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chin-Liang Chen, Chien-Hsun Lee, Kuan-Lin Ho | 2021-03-23 |