Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Chi-Yang Yu, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |