Issued Patents 2021
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2021-12-28 |
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2021-12-28 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2021-12-07 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +2 more | 2021-11-23 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2021-11-16 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2021-10-19 |
| 11145614 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2021-10-12 |
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2021-10-05 |
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Ying-Jui Huang | 2021-10-05 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chien Ling Hwang +2 more | 2021-09-28 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2021-09-28 |
| 11133283 | Integrated fan-out device | Jiun Yi Wu, Chen-Hua Yu | 2021-09-28 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2021-09-14 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +1 more | 2021-09-14 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2021-08-31 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-08-24 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11101232 | Conductive micro pin | Ying-Jui Huang, Hsin-Hung Liao, Chien Ling Hwang | 2021-08-24 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Ying-Jui Huang | 2021-08-17 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |