Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2021-10-05 |
| 11101232 | Conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Chien Ling Hwang | 2021-08-24 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2021-08-17 |