Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-10-05 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-08-17 |
| 11024618 | Wafer-level underfill and over-molding | Chung-Shi Liu, Chien Ling Hwang, Yeong-Jyh Lin | 2021-06-01 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Jen-Chun Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |