JL

Jen-Chun Liao

TSMC: 1 patents #1,794 of 3,494Top 55%
Overall (2021): #410,036 of 548,734Top 75%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10985135 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu 2021-04-20